July 30, 2021

CHICAGO PIXELS

SEMICONDUCTOR RESEARCH CENTER

ASM AMICRA unveils first systems incorporating X-Celeprint’s MTP technology for high-volume heterogeneous integration of ultra-thin chips

ASM AMICRA Microtechnologies GmbH of Regensburg, Germany, a subsidiary of Singapore-based hardware and software supplier ASM Pacific Technology Ltd, has announced three new manufacturing systems that combine its high-precision die bonding technology with the micro-transfer printing (MTP) technology of X-Celeprint of Cork, Ireland to introduce what is claimed to be the first complete system to enable high-volume heterogeneous integration of ultra-thin dies onto base wafers up to 300mm in diameter…