November 26, 2021

CHICAGO PIXELS

SEMICONDUCTOR RESEARCH CENTER

Axus improves process performance for single-wafer SiC CMP

Axus Technology of Chandler, AZ, USA – a provider of chemical-mechanical polishing/planarization (CMP), wafer thinning and surface-processing solutions) – has been working to develop and improve CMP process performance and hardware capability for single-wafer silicon carbide (SiC) CMP applications. The primary focus of these efforts include: (1) thin/fragile wafer handling reliability, (2) premium substrate flatness (total thickness variation, or TTV), (3) substrate surface quality, and (4) reduced cost of ownership (CoO)…