Intel presented yesterday on their plans for process technology and packaging over the next several years. This was the most...
3nm
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FinFETs devices are reaching their limits for scaling. Horizontal Nanosheets (HNS) are a type of Gate All Around (GAA) device...
At the 2021 Symposium on VLSI Technology and Circuits in June a short course was held on “Advanced Process and...
Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap. This article...
Over the recent years, the volume and velocity of discussions relating to chiplets have intensified. A major reason for this...
IBM has announced the development of a 2nm process. IBM Announcement What was announced: “2nm” 50 billion transistors in a...
TSMC recently announced plans to spend $100 billion dollars over three years on capital. For 2021 they announced $30B in...
At the SPIE Advanced Lithography Conference held in February, ASML presented the latest information on their Deep Ultraviolet (DUV) and...
There are reports in the media that TSMC is now planning six Fabs in Arizona (the image above is Fab...
There is a lot of interest right now in how Intel compares to the leading foundries and what the future...