Multi-chip modules are now more important than ever, even though the basic concept has been around for decades. With The...
Kinam Kim is a longtime Samsung technologist who has published many excellent articles over the years. He is now the...
ams OSRAM of Premstaetten, Austria is expanding its partnership with Cepton Technologies of San Jose, CA, USA to provide light...
GaN Systems Inc of Ottawa, Ontario, Canada (a fabless developer of gallium nitride-based power switching semiconductors for power conversion and...
Tokyo-based Toshiba Electronic Devices & Storage Corp (TDSC) - spun off from Toshiba Corp in 2017 - has launched two...
Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D...
Automatic adaptive meshing in Ansys HFSS is a critical component of its finite element method (FEM) simulation process. Guided by...
At Photonics West 2022 in San Francisco (22-27 January), TRUMPF Photonic Components GmbH of Ulm, Germany (part of the TRUMPF...
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA – which makes enhancement-mode gallium nitride on silicon (eGaN) power...